The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.

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This project has received funding from the Federal Ministry of Education and Research under grant agreement no [16ES]. Through dividing the solar cells in half cells micrpmac integrating in modules electrical losses can be reduced.

3D-Micromac – Our Headquarter in Chemnitz, Germany

All systems use UV lasers for permanent marking. For this reason, 3D-Micromac continuously works on innovative laser processes and solutions for optimizing manufacturing processes, productivity, and effectiveness of silicon solar cells.

The work is supported by five academic institute partners. The certification covers the entire spectrum of development, production, sales and service of our machines, plants and technologies. The ever-new technical challenges that make us grow.

Our team of experts develop processes, machinery and complete systems at the highest technical and technological level. We also specialize in the use of excimer lasers for microprocessing.

Our products help increase production efficiency, optimize processes and lower costs in various areas of technology. Innovative laser processes are revolutionizing industrial manufacturing worldwide.

Markets – Laser Micromachining – 3D-Micromac AG

Some of the technologies are being researched in cooperation with cooperation partners from the partner cluster in Yonezawa, Japan. They are characterized by extraordinary reliability and productivity, fine precision, and flexibility. The microPREP systems an be used for a variety of sample preparation techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe tomography, and micro mechanics.

In its strategic alignment 3D-Micromac concentrates particularly on international and high-growth, high-tech markets. Microstructure diagnostics and failure analyses are pivotal for the ongoing improvement of functional materials and sophisticated electronic components. All methods comply with the requirements of industrial display production and guarantee clean and gentle processing, without any discoloration of the material, and excellent edge quality and breakage resistance.


Although lasers are well established tools in manifold applications, they have been broadly ignored for use in sample preparation due to concerns regarding their potential for causing structural damage. The separated cells show a significantly higher mechanical strength, better edge quality and a lower power reduction compared to laser scribing and breaking approaches.

As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP systems bring additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for more comprehensive testing of complex structures.

Firstly the developments micromxc oriented to the state of the art. Approaches for the further substantial increase of the throughput should microomac developed with respect to the equipment.

Products – Laser Micromachining – 3D-Micromac AG

For the production in the roll-to-roll process, the winding processes of the thin glass substrate must first be integrated to the coating unit. The four major European semiconductor and system suppliers Infineon, STMicroelectronics, Bosch and Thales will collaborate with eleven equipment and analytical method suppliers from Germany and France. Those properties should be unchanged after cutting.

This has created a greater need for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device. This opens up a huge variety of possibilities micdomac niche applications for BIPV.

The system features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers near infrared, green and ultravioletresulting in a highly flexible, high-quality laser annealing platform. For the past 16 years, the name 3D-Micromac AG stands for highest quality and satisfied customers.


As a further challenge, laser cutting and structuring processes are developed for micrimac separation and interconnection.

It is only because of our laser processes that efficient series production of new and innovative components and products are made possible. If you continue to use this site we will assume that you are happy with it. From the founding of our company until today we have constantly been able to achieve important milestones:.

By constantly optimizing all internal business processes, we set the course for the steady growth of our company and for a lasting partnership with our customers and suppliers.

At 3D-Micromac, we not only successfully provide our customers with high quality, reliable and user-friendly standard systems for all applications in laser micromachining, we also provide branch-specific solutions. This especially applies to the excimer and ultra-short pulse laser systems, as well as the roll-to-roll laser machining of flexible substrates. At the same time, traditional scaling of feature sizes in microelectronics is becoming increasingly cost prohibitive in order to add more functionality on devices within a smaller footprint.


With this certification, we prove our successful quality management and micromax efficiency of our process chains as well as our efforts to a continuous improvement. Laser processing on-the-fly and an 3r handling concept enable maximum throughput and yield in the mass production of crystalline solar cells.

Strategic realignment focusing on industrial growth markets The constant cost pressure in the photovoltaic industry as a continues challenge to solar cell manufacturers can only be solved by increasing cell efficiency with simultaneous reducing manufacturing costs. More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e.